Kunigal N.Shivakumar1, Shivalingappa Lingaiah2, Robert Sadler2, Matthew Sharpe2
CMC-Computers, Materials & Continua, Vol.1, No.4, pp. 309-318, 2004, DOI:10.3970/cmc.2004.001.309
Abstract The exfoliation and dispersion of nanoclay (2% by weight) and nanovermiculite (2% by weight) particles in a polymer matrix is analyzed using the Scanning Electron Microscope (SEM) after a low temperature air plasma etch. The plasma etch preferentially removes the polymer to expose the nanoparticles. Both Argon and air have been used as the etching media to study the etching process. SEM analysis illustrate the results of the etching in flat and edge surfaces of both nanoclay (MMT) and nanovermiculite (VMT) filled polymer. Both the MMT and VMT were dispersed using a IKA high shear More >
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