N. D. Ngo, K. K. Tamma¹

CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.3, pp. 57-72, 2000, DOI:10.3970/cmes.2000.001.359

Abstract In the process modeling via Resin Transfer Molding (RTM) for thick composite sections, multi-layer preforms with varying thermophysical characteristics across the different layers, or for geometrically complex mold geometries with varying thicknesses, the assumption of a thin shell-like geometry is no longer valid. The flow in the through thickness direction is no longer negligible and current practices of treating the continuously moving flow front as two-dimensional and the temperature and cure as three-dimensional are not representative of the underlying physics. In view of these considerations, in the present study, the focus is on the non-isothermal… More >

K. Garikipati¹, V.S. Rao², M.Y. Hao³, E. Ibok⁴, I. de Wolf⁵, R. W. Dutton⁶

CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 65-84, 2000, DOI:10.3970/cmes.2000.001.065

Abstract This work is based upon a careful rendering of mechanics and mathematics to describe the phenomena that influence the stress engendered by the Shallow Trench Isolation process. The diffusion-reaction problem is posed in terms of fundamental mass balance laws. Finite strain kinematics is invoked to model the large expansion of SiO₂, dielectrics are modelled as viscoelastic solids and annealing-induced density relaxation of SiO₂ is incorporated as a history-dependent process. A levelset framework is used to describe the moving Si/SiO₂ interface. Sophisticated finite element methods are employed to solve the mathematical equations posed for each phenomenon. These include More >