@Article{sl.2012.007.151,
AUTHOR = {Wei-Chung Wang, Yu-An Chiang, Yi-Chieh Ho, Hung-Tsan Shen, Ting-Yu Chang, Ya-Hsin Chang, Chun-Sheng Tsao},
TITLE = {Mechanical Properties Measurement of Soft Materials by Three-Dimensional Digital Image Correlation Method},
JOURNAL = {Structural Longevity},
VOLUME = {7},
YEAR = {2012},
NUMBER = {3},
PAGES = {151--160},
URL = {http://www.techscience.com/sl/v7n3/42870},
ISSN = {1944-6128},
ABSTRACT = {The rapid development of soft materials in recent years gives revolutionary impact on electronics and biomedical industries. To better control the
quality and key technology, mechanical properties of soft materials employed in
electronics and biomedical industries must be accurately determined By employing the non-destructive, non-contact and whole-field characteristics of the threedimensional (3D) digital image correlation (DIC) method, epoxy resin used in photoviscoelasticity, mechanical properties of optical films used in backlight modules
and artificial meshes used in biomedical applications were investigated in this paper. It was found that satisfactory accuracy and measurement range can be obtained
from the 3D-DIC method on the measurement of mechanical properties of soft materials.},
DOI = {10.3970/sl.2012.007.151}
}