TY  - EJOU
AU  - Xu, B. 
AU  - Tong, W.P. 
AU  - Zhang, H. 
AU  - Zuo, L. 
AU  - He, J. C. 

TI  - Study on Reaction Diffusion Behavior in NG-Al/CG-Cu Diffusion Couple
T2  - Structural Longevity

PY  - 2012
VL  - 8
IS  - 3
SN  - 1944-6128

AB  - A novel technique has been developed to produce nanostructuregrained (NG) Al coatings on Cu plate by means of surface mechanical attrition
treatment (SMAT). The reaction diffusion behavior in nanostructure-grained (NG)
Al/course-grained (CG) Cu diffusion couple was investigated by scanning electron
microscopy (SEM) and transmission electron microscopy (TEM). The experimental results showed that the aluminizing kinetics of NG coating on Cu plate was obviously enhanced, and the temperature to form compound layer was also greatly reduced with respect to the coarse-grained (CG) Al/coarse-grained (CG) Cu diffusion
couple. The activation energy for compound layer growth in the NG-Al/CG-Cu diffusion couple was calculated from the temperature dependence of compound layer
thickness, the obtained values being about 97.85 <i>kJ/mol</i>, which is much smaller
than that in the previous report for Al diffusion in the CG Cu (136 <i>kJ/mol</i>).
KW  - Reaction diffusion
KW  -  nanostructure
KW  -  aluminizing
KW  -  surface mechanical attrition treatment

DO  - 10.3970/sl.2012.008.139