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25 Sep 2019
Tech Science Press (TSP) is pleased to announce that Dr. Xingming Sun and Dr. Ankit Agrawal have been named Editors-in-Chief of CMC-Computers, Materials & Continua. They will serve in this position on S.
Dr. Xingming Sun is currently a Professor and the Dean in the College of Computer and Software at Nanjing University of Information Science & Technology, China. In the past, he has been a Professor in the College of Computer and Communication at Hunan University, China. He was a Visiting Professor at University College London and University of Warwick, UK. He received the B.S. degree in mathematics from Hunan Normal University, China, in 1984, the M.S. degree in computing science from Dalian University of Science and Technology, China, in 1988, and the Ph.D. degree in computing science from Fudan University, China, in 2001. His research interests include network and information security, digital watermarking, cloud computing security, and wireless network security. He has published more than 100 research papers in major international academic journals and peer-reviewed conference proceedings. He is the general chair of ICCCS 2015, ICCCS 2016, ICCCS 2017, ICCCS 2018, ICAIS 2019, and ACM TURCAIS 2019. His research has been supported by NSFC, 863, 973. He is a recipient of Science and Technology Progress Award, and a senior member of IEEE.
Dr. Ankit Agrawal (Ph.D. 2009, B.Tech. 2006) is a Research Associate Professor in the Department of Electrical and Computer Engineering at Northwestern University, USA, and specializes in interdisciplinary big data analytics via high performance data mining, based on a coherent integration of high performance computing and data mining to develop customized solutions for big data problems. His research has contributed to large-scale data-guided discovery in various scientific and engineering disciplines, such as materials science, healthcare, bioinformatics, and social media. He has co-authored 100+ peer-reviewed journal and conference publications, including those at top-tier computer science venues such as KDD, ICDM, CIKM, SDM, ICDE, Supercomputing, HiPC, and interdisciplinary ones like Nature Scientific Reports, APL Materials, MRS Communications, npj Computational Materials, Acta Materialia, Journal of Mechanical Design, Journal of American Medical Informatics Association, Journal of Computational Chemistry, IEEE/ACM Transactions on Computational Biology and Bioinformatics, etc. He has also developed and released several open-source software, delivered numerous invited/keynote talks, been on program committees of major research conferences, and served as a PI/Co-PI on more than a dozen sponsored projects funded by various US federal agencies (e.g. NSF, DOE, AFOSR, NIST, DARPA, DLA) as well as industry (e.g. Toyota Motor Corporation Japan).
We are excited to have Dr. Xingming Sun and Dr. Ankit Agrawal in the position to build on the work of past achievements and bring the journal to reach new heights and we believe that CMC will achieve a higher standard and greater prestige under the leadership of them. Please join us in wishing them all the best in their new roles!