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Bending, Free Vibration and Buckling Analysis of Functionally Graded Plates via Wavelet Finite Element Method

Hao Zuo1,2, Zhibo Yang1,2,3, Xuefeng Chen1,2, Yong Xie4, Xingwu Zhang1,2

The State Key Laboratory for Manufacturing Systems Engineering, Xi’an, P.R. China.
School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an, P.R. China.
Corresponding author. Tel: +86 29 82667963; Fax: +86 29 82663689.E-mail: yangbo-5-7@163.com
State Key Laboratory of Strength and Vibration for Mechanical Struictures, School of Aerospace.

Computers, Materials & Continua 2014, 44(3), 167-204. https://doi.org/10.3970/cmc.2014.044.167

Abstract

Following previous work, a wavelet finite element method is developed for bending, free vibration and buckling analysis of functionally graded (FG) plates based on Mindlin plate theory. The functionally graded material (FGM) properties are assumed to vary smoothly and continuously throughout the thickness of plate according to power law distribution of volume fraction of constituents. This article adopts scaling functions of two-dimensional tensor product BSWI to form shape functions. Then two-dimensional FGM BSWI element is constructed based on Mindlin plate theory by means of two-dimensional tensor product BSWI. The proposed two-dimensional FGM BSWI element possesses the advantages of high convergence, high accuracy and reliability with fewer degrees of freedoms on account of the excellent approximation property of BSWI. Numerical examples concerning various length-to-thickness ratios, volume fraction indexes, aspect ratios and boundary conditions are carried out for bending, free vibration and buckling problems of FG plates. These comparison examples demonstrate the accuracy and reliability of the proposed WFEM method comparing with the exact and referential solutions available in literatures.

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Cite This Article

H. . Zuo, Z. . Yang, X. . Chen, Y. . Xie and X. . Zhang, "Bending, free vibration and buckling analysis of functionally graded plates via wavelet finite element method," Computers, Materials & Continua, vol. 44, no.3, pp. 167–204, 2014. https://doi.org/10.3970/cmc.2014.044.167



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