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A Smoothed Four-Node Piezoelectric Element for Analysis of Two-Dimensional Smart Structures

H. Nguyen-Van1, N. Mai-Duy2, T. Tran-Cong3

CESRC, Faculty of Engineering & Surveying, USQ, Australia
CESRC, Faculty of Engineering & Surveying, USQ, Australia
CESRC, Faculty of Engineering & Surveying, USQ, Australia

Computer Modeling in Engineering & Sciences 2008, 23(3), 209-222. https://doi.org/10.3970/cmes.2008.023.209

Abstract

This paper reports a study of linear elastic analysis of two-dimensional piezoelectric structures using a smoothed four-node piezoelectric element. The element is built by incorporating the strain smoothing method of mesh-free conforming nodal integration into the standard four-node quadrilateral piezoelectric finite element. The approximations of mechanical strains and electric potential fields are normalized using a constant smoothing function. This allows the field gradients to be directly computed from shape functions. No mapping or coordinate transformation is necessary so that the element can be used in arbitrary shapes. Through several examples, the simplicity, efficiency and reliability of the element are demonstrated. Numerical results and comparative studies with other existing solutions in the literature suggest that the present element is robust, computationally inexpensive and easy to implement.

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APA Style
Nguyen-Van, H., Mai-Duy, N., Tran-Cong, T. (2008). A smoothed four-node piezoelectric element for analysis of two-dimensional smart structures. Computer Modeling in Engineering & Sciences, 23(3), 209-222. https://doi.org/10.3970/cmes.2008.023.209
Vancouver Style
Nguyen-Van H, Mai-Duy N, Tran-Cong T. A smoothed four-node piezoelectric element for analysis of two-dimensional smart structures. Comput Model Eng Sci. 2008;23(3):209-222 https://doi.org/10.3970/cmes.2008.023.209
IEEE Style
H. Nguyen-Van, N. Mai-Duy, and T. Tran-Cong "A Smoothed Four-Node Piezoelectric Element for Analysis of Two-Dimensional Smart Structures," Comput. Model. Eng. Sci., vol. 23, no. 3, pp. 209-222. 2008. https://doi.org/10.3970/cmes.2008.023.209



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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