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Numerical Simulation of Cohesive Fracture by the Virtual-Internal-Bond Model

P. Zhang1, P. Klein2, Y. Huang1,3, H. Gao4, P. D. Wu5

Department of Mechanical and Industrial Engineering, University of Illinois, Urbana, IL 61801
Sandia National Laboratories, Livermore, CA 94551
Corresponding author; email: huang9@uiuc. edu; fax: (217) 244-6534
Division of Mechanics and Computation, Stanford University, Palo Alto, CA 94305
Alcan International Limited, P.O. Box 8400, Kingston, Ontario K7L 5L9, Canada

Computer Modeling in Engineering & Sciences 2002, 3(2), 263-278. https://doi.org/10.3970/cmes.2002.003.263

Abstract

The recently developed virtual-internal-bond (VIB) model has incorporated a cohesive-type law into the constitutive law of solids such that fracture and failure of solids become a coherent part of the constitutive law and no separate fracture or failure criteria are needed. A numerical algorithm is developed in this study for the VIB model under static loadings. The model is applied to study three examples, namely the crack nucleation and propagation from stress concentration, kinking and subsequent propagation of a mode II crack, and the buckling-driven delamination of a thin film from a substrate. The results have demonstrated that the VIB model provides an effective method to study crack nucleation and propagation in engineering materials and systems.

Cite This Article

APA Style
Zhang, P., Klein, P., Huang, Y., Gao, H., Wu, P.D. (2002). Numerical simulation of cohesive fracture by the virtual-internal-bond model. Computer Modeling in Engineering & Sciences, 3(2), 263-278. https://doi.org/10.3970/cmes.2002.003.263
Vancouver Style
Zhang P, Klein P, Huang Y, Gao H, Wu PD. Numerical simulation of cohesive fracture by the virtual-internal-bond model. Comput Model Eng Sci. 2002;3(2):263-278 https://doi.org/10.3970/cmes.2002.003.263
IEEE Style
P. Zhang, P. Klein, Y. Huang, H. Gao, and P.D. Wu, “Numerical Simulation of Cohesive Fracture by the Virtual-Internal-Bond Model,” Comput. Model. Eng. Sci., vol. 3, no. 2, pp. 263-278, 2002. https://doi.org/10.3970/cmes.2002.003.263



cc Copyright © 2002 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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