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Transient Thermal Response of a Partially Insulated Crack in an Orthotropic Functionally Graded Strip under Convective Heat Supply

Yueting Zhou1, Xing Li2, Dehao Yu1

LSEC, ICMSEC, Academy of Mathematics and Systems Science, CAS, Beijing 100190, China
School of Mathematics and Computer Science, Ningxia University, Yinchuan 750021, China

Computer Modeling in Engineering & Sciences 2009, 43(3), 191-222. https://doi.org/10.3970/cmes.2009.043.191

Abstract

The transient response of an orthotropic functionally graded strip with a partially insulated crack under convective heat transfer supply is considered. It is modeled there exists thermal resistant in the heat conduction through the crack region. The mixed boundary value problems of the temperature field and displacement field are reduced to a system of singular integral equations in Laplace domain. The expressions with high order asymptotic terms for the singular integral kernel are considered to improve the accuracy and efficiency. The numerical results present the effect of the material nonhomogeneous parameters, the orthotropic parameters and dimensionless thermal resistant on the temperature distribution and the transient thermal stress intensity factors with different dimensionless timet.

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APA Style
Zhou, Y., Li, X., Yu, D. (2009). Transient thermal response of a partially insulated crack in an orthotropic functionally graded strip under convective heat supply. Computer Modeling in Engineering & Sciences, 43(3), 191-222. https://doi.org/10.3970/cmes.2009.043.191
Vancouver Style
Zhou Y, Li X, Yu D. Transient thermal response of a partially insulated crack in an orthotropic functionally graded strip under convective heat supply. Comput Model Eng Sci. 2009;43(3):191-222 https://doi.org/10.3970/cmes.2009.043.191
IEEE Style
Y. Zhou, X. Li, and D. Yu "Transient Thermal Response of a Partially Insulated Crack in an Orthotropic Functionally Graded Strip under Convective Heat Supply," Comput. Model. Eng. Sci., vol. 43, no. 3, pp. 191-222. 2009. https://doi.org/10.3970/cmes.2009.043.191



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