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Numerical Study of Indentation Delamination of Strongly Bonded Films by Use of a Cohesive Zone Model

W. Li1 and T. Siegmund1

1 Purdue University, West Lafayette, IN, U.S.A

Computer Modeling in Engineering & Sciences 2004, 5(1), 81-90. https://doi.org/10.3970/cmes.2004.005.081

Abstract

Results of a computational study of the mechanics of indentation induced interface delamination are described for a system consisting of a ductile film on an elastic substrate. Special attention is paid to the properties of the interface between film and substrate, and the influence of the interface properties on the indentation response. Specifically, strong interfaces are considered. The interface is characterized by the use of a cohesive zone model. The finite element method is used to solve the boundary value problem, with the interface behavior incorporated via a cohesive model in a traction-separation formulation. The model does not include any initial defects and the formation of the indentation-induced delamination is accounted for in the model. While for weak interfaces buckling of the film occurs, for strong interfaces mode II delamination at the interface dominates and can be connected to pop-in events. The investigation describes a scheme such that indentation experiments can be used to determine the properties of the film-substrate interface even for strong interfaces.

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APA Style
Siegmund, W.L.A.T. (2004). Numerical study of indentation delamination of strongly bonded films by use of a cohesive zone model. Computer Modeling in Engineering & Sciences, 5(1), 81-90. https://doi.org/10.3970/cmes.2004.005.081
Vancouver Style
Siegmund WLAT. Numerical study of indentation delamination of strongly bonded films by use of a cohesive zone model. Comput Model Eng Sci. 2004;5(1):81-90 https://doi.org/10.3970/cmes.2004.005.081
IEEE Style
W.L.A.T. Siegmund, "Numerical Study of Indentation Delamination of Strongly Bonded Films by Use of a Cohesive Zone Model," Comput. Model. Eng. Sci., vol. 5, no. 1, pp. 81-90. 2004. https://doi.org/10.3970/cmes.2004.005.081



cc Copyright © 2004 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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