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The MLPG for Bending of Electroelastic Plates

J. Sladek1, V. Sladek1, P. Stanak1, E. Pan2

Institute of Construction and Architecture, Slovak Academy of Sciences, 84503 Bratislava, Slovakia
Computer Modeling and Simulation Group, Department of Civil Engineering, University of Akron, Akron, OH 44325-3905, USA

Computer Modeling in Engineering & Sciences 2010, 64(3), 267-298. https://doi.org/10.3970/cmes.2010.064.267

Abstract

The plate equations are obtained by means of an appropriate expansion of the mechanical displacement and electric potential in powers of the thickness coordinate in the variational equation of electroelasticity and integration through the thickness. The appropriate assumptions are made to derive the uncoupled equations for the extensional and flexural motion. The present approach reduces the original 3-D plate problem to a 2-D problem, with all the unknown quantities being localized in the mid-plane of the plate. A meshless local Petrov-Galerkin (MLPG) method is then applied to solve the problem. Nodal points are randomly spread in the mid-plane of the plate and each node is surrounded by a circular subdomain. The weak forms for the governing equations on subdomains with appropriate test functions are applied to derive local integral equations. The meshless approximation based on the moving least-squares (MLS) method is employed for the implementation. After performing the spatial MLS approximation, a system of ordinary differential equations for the nodal unknowns is obtained. The corresponding system of ordinary differential equations of the second order resulting from the equations of motion is solved by the Houbolt finite-difference scheme as a time-stepping method.

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APA Style
Sladek, J., Sladek, V., Stanak, P., Pan, E. (2010). The MLPG for bending of electroelastic plates. Computer Modeling in Engineering & Sciences, 64(3), 267-298. https://doi.org/10.3970/cmes.2010.064.267
Vancouver Style
Sladek J, Sladek V, Stanak P, Pan E. The MLPG for bending of electroelastic plates. Comput Model Eng Sci. 2010;64(3):267-298 https://doi.org/10.3970/cmes.2010.064.267
IEEE Style
J. Sladek, V. Sladek, P. Stanak, and E. Pan, “The MLPG for Bending of Electroelastic Plates,” Comput. Model. Eng. Sci., vol. 64, no. 3, pp. 267-298, 2010. https://doi.org/10.3970/cmes.2010.064.267



cc Copyright © 2010 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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