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Parallel Computing Performance of Thermal-Structural Coupled Analysis in Parallel Computing Resource

Jong Keun Moon1, Seung Jo Kim2

School of Mechanical and Aerospace Engineering, Seoul National University, Seoul 151-742, Republic of Korea
Flight Vehicle Research Center, Seoul National University, Seoul 151-742, Republic of Korea AIAA Fellow, Fellow of IoP

Computer Modeling in Engineering & Sciences 2010, 67(3), 239-264. https://doi.org/10.3970/cmes.2010.067.239

Abstract

Large structural problems with high precision and complexity require a high-performance computation using the efficient parallel algorithm. The purpose of this paper is to present the parallel performance of thermal-structural coupled analysis tested on a parallel cluster system. In the coupled analysis, the heat transfer analysis is carried out, and then the structural analysis is performed based on temperature distribution. For the automatic and efficient connection of two parallel analysis modules, the several communication patterns were studied. The parallel performance was demonstrated for the sample and the real application problems, such as a laminated composite material by the DNS(Direct Numerical Simulation) approach and an aerospace launch vehicle model.

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APA Style
Moon, J.K., Kim, S.J. (2010). Parallel computing performance of thermal-structural coupled analysis in parallel computing resource. Computer Modeling in Engineering & Sciences, 67(3), 239-264. https://doi.org/10.3970/cmes.2010.067.239
Vancouver Style
Moon JK, Kim SJ. Parallel computing performance of thermal-structural coupled analysis in parallel computing resource. Comput Model Eng Sci. 2010;67(3):239-264 https://doi.org/10.3970/cmes.2010.067.239
IEEE Style
J.K. Moon and S.J. Kim, "Parallel Computing Performance of Thermal-Structural Coupled Analysis in Parallel Computing Resource," Comput. Model. Eng. Sci., vol. 67, no. 3, pp. 239-264. 2010. https://doi.org/10.3970/cmes.2010.067.239



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