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Simulations of Three-dimensional Thermal Residual Stress and Warpage in Injection Molding

Xuejuan Li1,2, Jie Ouyang2,3, Wen Zhou2

School of Science, Xi’an University of Architecture and Technology, Xi’an, 710055, PR China.
School of Science, Northwestern Polytechnical University, Xi’an, 710129, PR China, jieouyang@nwpu.edu.cn
Corresponding author. Email: jieouyang@nwpu.edu.cn

Computer Modeling in Engineering & Sciences 2013, 96(6), 379-407. https://doi.org/10.3970/cmes.2013.096.379

Abstract

The three-dimensional (3D) mathematical models for thermal residual stress and warpage are proposed in injection molding, in which the temperature model is rebuilt by considering the phase-change effect to improve the computational accuracy. The 3D thermal residual stress model is transformed into the incremental displacement model so that the boundary conditions can be imposed easily. A modified finite element neural network (FENN) method is used for solving 3D warpage model based on the advantages of finite element method and neural network. The influence of phase-change on temperature is discussed. The numerical simulations of thermal residual stress and warpage are realized, and the influences of processing parameters on thermal residual stress and warpage are studied. The numerical results are in accordance with the results in related literature and the theoretic analysis.

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Cite This Article

APA Style
Li, X., Ouyang, J., Zhou, W. (2013). Simulations of three-dimensional thermal residual stress and warpage in injection molding. Computer Modeling in Engineering & Sciences, 96(6), 379-407. https://doi.org/10.3970/cmes.2013.096.379
Vancouver Style
Li X, Ouyang J, Zhou W. Simulations of three-dimensional thermal residual stress and warpage in injection molding. Comput Model Eng Sci. 2013;96(6):379-407 https://doi.org/10.3970/cmes.2013.096.379
IEEE Style
X. Li, J. Ouyang, and W. Zhou "Simulations of Three-dimensional Thermal Residual Stress and Warpage in Injection Molding," Comput. Model. Eng. Sci., vol. 96, no. 6, pp. 379-407. 2013. https://doi.org/10.3970/cmes.2013.096.379



cc Copyright © 2013 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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