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Molecular Dynamics Simulations of the Nanoindentation for Aluminum and Copper

Xiaozhi Tang1, Yafang Guo1, Yu Gao1

1 Institute of Engineering Mechanics, Northern Jiaotong University, Beijing 100044, China

Computers, Materials & Continua 2011, 23(1), 1-8. https://doi.org/10.3970/cmc.2011.023.001

Abstract

Atomistic simulations were performed to study the nanoindentation for two kinds of FCC metals, aluminum and copper. Due to the higher stacking faults in aluminum than in copper, two different deformation mechanisms were observed in our simulation under exactly the same simulation condition. Aluminum and copper also showed different mechanical properties in the unloading stage. The influence of stacking sequence along the loading direction on deformation mechanism was also investigated in this paper.

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Cite This Article

X. Tang, Y. Guo and Y. Gao, "Molecular dynamics simulations of the nanoindentation for aluminum and copper," Computers, Materials & Continua, vol. 23, no.1, pp. 1–8, 2011.



cc This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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