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Modeling of Effective Properties of Multiphase Magnetoelectroelastic Heterogeneous Materials

A. Bakkali1, L. Azrar1,2, N. Fakri1

Mathematical Modeling and Control; Faculty of Sciences and Techniques of Tangier, University Abdelmalek Essaâdi; BP 416 Tangier; Morocco
Corresponding author: l.azrar@uae.ma; l.azrar@fstt.ac.ma

Computers, Materials & Continua 2011, 23(3), 201-232. https://doi.org/10.3970/cmc.2011.023.201

Abstract

In this paper an N-phase Incremental Self Consistent model is developed for magnetoelectroelastic composites as well as the N-phase Mori-Tanaka and classical Self Consistent. Our aim here is to circumvent the limitation of the Self Consistent predictions for some coupling effective properties at certain inclusion volume fractions. The anomalies of the SC estimates are more drastic when the void inclusions are considered. The mathematical modeling is based on the heterogeneous inclusion problem of Eshelby which leads to an expression for the strain-electric-magnetic field related by integral equations. The effective N-phase magnetoelectroelastic moduli are expressed as a function of magnetoelectroelastic concentration tensors based on the considered micromechanical models. The effective properties are obtained for various types, shapes and volume fractions of inclusions and compared with the existing results.

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APA Style
Bakkali, A., Azrar, L., Fakri, N. (2011). Modeling of effective properties of multiphase magnetoelectroelastic heterogeneous materials. Computers, Materials & Continua, 23(3), 201-232. https://doi.org/10.3970/cmc.2011.023.201
Vancouver Style
Bakkali A, Azrar L, Fakri N. Modeling of effective properties of multiphase magnetoelectroelastic heterogeneous materials. Comput Mater Contin. 2011;23(3):201-232 https://doi.org/10.3970/cmc.2011.023.201
IEEE Style
A. Bakkali, L. Azrar, and N. Fakri "Modeling of Effective Properties of Multiphase Magnetoelectroelastic Heterogeneous Materials," Comput. Mater. Contin., vol. 23, no. 3, pp. 201-232. 2011. https://doi.org/10.3970/cmc.2011.023.201



cc Copyright © 2011 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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