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Thermo-elastic Stresses in a Functional Graded Material Under Thermal Loading, Pure Bending and Thermo-mechanical Coupling

Wei Zhang1,2, Pengcheng Ni2, Bingfei Liu1,3

Airport College, Civil Aviation University of China, Tianjin, 300300, China.
Sino-European Institute of Aviation Engineering, Civil Aviation University of China, Tianjin, 300300, China.
Corresponding author. Tel.: +1-86-2224092477; E-mail: bfliu@cauc.edu.cn

Computers, Materials & Continua 2014, 44(2), 105-122. https://doi.org/10.3970/cmc.2014.044.105

Abstract

Analytical expressions have been derived for the through thickness stresses of a Functional graded materials (FGMs) thin plate subjected to thermal loading, pure bending and thermo-mechanical coupling, respectively. The structure is comprised of a metallic layer, a ceramic layer and a functional graded layer. Continuous gradation of the volume fraction in the FGM layer is modeled in the form of an "m" power polynomial of the coordinate axis in thickness direction of the plate. Numerical scheme of discretizing the continuous FGM layer with different graded distributions such as linear (m=1), quadratic (m=2) and square root (m=0.5) has been developed by the averaging technique of composites. Solutions for the stress distributions have been derived for the system under thermal loading, pure bending and thermo-mechanical coupling, respectively.

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APA Style
Zhang, W., Ni, P., Liu, B. (2014). Thermo-elastic stresses in a functional graded material under thermal loading, pure bending and thermo-mechanical coupling. Computers, Materials & Continua, 44(2), 105-122. https://doi.org/10.3970/cmc.2014.044.105
Vancouver Style
Zhang W, Ni P, Liu B. Thermo-elastic stresses in a functional graded material under thermal loading, pure bending and thermo-mechanical coupling. Comput Mater Contin. 2014;44(2):105-122 https://doi.org/10.3970/cmc.2014.044.105
IEEE Style
W. Zhang, P. Ni, and B. Liu "Thermo-elastic Stresses in a Functional Graded Material Under Thermal Loading, Pure Bending and Thermo-mechanical Coupling," Comput. Mater. Contin., vol. 44, no. 2, pp. 105-122. 2014. https://doi.org/10.3970/cmc.2014.044.105



cc Copyright © 2014 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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