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An Inverse Approach to Determine the Mechanical Properties of Elastoplastic Materials Using Indentation Tests

Xiuqing Qian1, Yanping Cao2, Jianyu Zhang1, Dierk Raabe2, Zhenhan Yao3, Binjun Fei1

Solid Mechanics Research Centre, Beijing University of Aeronautics and Astronautics, Beijing 100083, PR China.qianxq@buaa.edu.cn
Max Planck Institute für Eisenforschung in Düsseldorf,40237, Germany. cypqjl@yahoo.com or cao.y@mpie.de
Department of Engineering Mechanics, Tsinghua University, Beijing,100084, PR China. demyzh@tsinghua.edu.cn

Computers, Materials & Continua 2008, 7(1), 33-42. https://doi.org/10.3970/cmc.2008.007.033

Abstract

In this work, an inverse approach based on depth-sensing instrumented indentation tests is proposed to determine the Young's modulus, yield strength and strain hardening exponent of the materials for which the elastoplastic part of the stress-strain curve can be described using a power function. Numerical verifications performed on typical engineering metals demonstrate the effectiveness of the new method. The sensitivity of the method to data noise and some experimental uncertainties are also discussed, which may provide useful information for the application of the method in practice.

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APA Style
Qian, X., Cao, Y., Zhang, J., Raabe, D., Yao, Z. et al. (2008). An inverse approach to determine the mechanical properties of elastoplastic materials using indentation tests. Computers, Materials & Continua, 7(1), 33-42. https://doi.org/10.3970/cmc.2008.007.033
Vancouver Style
Qian X, Cao Y, Zhang J, Raabe D, Yao Z, Fei B. An inverse approach to determine the mechanical properties of elastoplastic materials using indentation tests. Comput Mater Contin. 2008;7(1):33-42 https://doi.org/10.3970/cmc.2008.007.033
IEEE Style
X. Qian, Y. Cao, J. Zhang, D. Raabe, Z. Yao, and B. Fei, “An Inverse Approach to Determine the Mechanical Properties of Elastoplastic Materials Using Indentation Tests,” Comput. Mater. Contin., vol. 7, no. 1, pp. 33-42, 2008. https://doi.org/10.3970/cmc.2008.007.033



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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