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ABSTRACT

Modal identification of structure under varying environmental conditions

Deyi Zhang1, Yuequan Bao, Feng Zhou, Hui Li

School of Civil Engineering, Harbin Institute of Technology, Harbin, 150090, China. Email:zhangdeyi@hit.edu.cn

The International Conference on Computational & Experimental Engineering and Sciences 2009, 12(2), 65-72. https://doi.org/10.3970/icces.2009.012.065

Abstract

Modal identification is essential in structural health monitoring (SHM) because that the modal parameters are often used for model updating and damage detection. However, in practical situations, the variation of environmental conditions (e.g. temperature, temperature gradients, humidity, etc.) will impede the reliability of modal identification. In this paper, firstly, the relation of frequency change and variation of environment temperature of space structure is investigated. Then, a structural state assessment method by combing autoregressive moving average (ARMA) and PCA is proposed. The acceleration data from China National Aquatics Center is employed as an example. The results show that variation of frequencies with increasing of temperature and wind velocity is not notable. That is because the temperature difference and velocity variation are little.

Cite This Article

APA Style
Zhang, D., Bao, Y., Zhou, F., Li, H. (2009). Modal identification of structure under varying environmental conditions. The International Conference on Computational & Experimental Engineering and Sciences, 12(2), 65-72. https://doi.org/10.3970/icces.2009.012.065
Vancouver Style
Zhang D, Bao Y, Zhou F, Li H. Modal identification of structure under varying environmental conditions. Int Conf Comput Exp Eng Sciences . 2009;12(2):65-72 https://doi.org/10.3970/icces.2009.012.065
IEEE Style
D. Zhang, Y. Bao, F. Zhou, and H. Li, “Modal identification of structure under varying environmental conditions,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 12, no. 2, pp. 65-72, 2009. https://doi.org/10.3970/icces.2009.012.065



cc Copyright © 2009 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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