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A Cosserat Bond-Based Correspondence Model
Zhuang Chen1, Xihua Chu1,*, Diansen Yang1
1 School of Civil Engineering, Wuhan University, Wuhan, 430072, China
* Corresponding Author: Xihua Chu. Email:
The International Conference on Computational & Experimental Engineering and Sciences 2023, 26(3), 1-1. https://doi.org/10.32604/icces.2023.09057
Abstract
In this study, we develop a Cosserat bond-based correspondence model(Cosserat BBCM) based on the bondbased correspondence model (BBCM)[1]. BBCM is a generalized bond-based peridynamic model, where the
peridynamic pair-wise force (PD force) is calculated by classical constitutive equations through the relation
between PD force and stress. In our previous study, we develop the Cosserat peridynamic model (CPM) to
investigate the microstructure-related crack growth behavior [2, 3]. But the interactions between material
particles are represented by PD forces and moments instead of the stress and couple stress. Due to this
divergence, the Cosserat constitutive model such as the elastoplastic Cosserat model [4] is hard to be
implemented into the CPM. To solve this problem, we try to introduce the Cosserat continuum into the BBCM
and develop the Cosserat BBCM, where the PD forces and moments are calculated by Cosserat constitutive
equations. In the numerical examples, the proposed Cosserat BBCM is validated through the comparison
with the Cosserat finite element method. And the influences of microstructure parameters (internal length
scale and Cosserat shear modulus) on the crack propagation are investigated.
Keywords
Cite This Article
APA Style
Chen, Z., Chu, X., Yang, D. (2023). A cosserat bond-based correspondence model. The International Conference on Computational & Experimental Engineering and Sciences, 26(3), 1-1. https://doi.org/10.32604/icces.2023.09057
Vancouver Style
Chen Z, Chu X, Yang D. A cosserat bond-based correspondence model. Int Conf Comput Exp Eng Sciences . 2023;26(3):1-1 https://doi.org/10.32604/icces.2023.09057
IEEE Style
Z. Chen, X. Chu, and D. Yang "A Cosserat Bond-Based Correspondence Model," Int. Conf. Comput. Exp. Eng. Sciences , vol. 26, no. 3, pp. 1-1. 2023. https://doi.org/10.32604/icces.2023.09057