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ABSTRACT

Sound wave propagation modeling in a 3D absorbing acoustic dome using the Method of Fundamental Solutions

J. António1 , A. Tadeu1, L. Godinho

Department of Civil Engineering, Faculty of Sciences and Technology of the University of Coimbra, Coimbra, Portugal

The International Conference on Computational & Experimental Engineering and Sciences 2007, 3(3), 157-162. https://doi.org/10.3970/icces.2007.003.157

Abstract

A frequency dependent formulation based on the Method of Fundamental Solutions (MFS) is used to simulate the sound wave propagation in a 3D acoustic space. This solution is approximated by a linear combination of fundamental solutions generated by virtual sources placed outside the domain in order to avoid singularities. The coating materials can be assumed to be absorbent. This is achieved in the model prescribing the impedance that is defined as a function of the absorption coefficient. The model is first verified against analytical solutions, provided by the image source technique for a parallelepiped room bounded by rigid walls. The applicability of the present model is illustrated by applying it to solve the case of a dome. The fundamental solutions used in this case are defined for a half-space, which avoids the placement of collocation points on the floor.

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APA Style
António, J., Tadeu, A., Godinho, L. (2007). Sound wave propagation modeling in a 3D absorbing acoustic dome using the method of fundamental solutions. The International Conference on Computational & Experimental Engineering and Sciences, 3(3), 157-162. https://doi.org/10.3970/icces.2007.003.157
Vancouver Style
António J, Tadeu A, Godinho L. Sound wave propagation modeling in a 3D absorbing acoustic dome using the method of fundamental solutions. Int Conf Comput Exp Eng Sciences . 2007;3(3):157-162 https://doi.org/10.3970/icces.2007.003.157
IEEE Style
J. António, A. Tadeu, and L. Godinho, “Sound wave propagation modeling in a 3D absorbing acoustic dome using the Method of Fundamental Solutions,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 3, no. 3, pp. 157-162, 2007. https://doi.org/10.3970/icces.2007.003.157



cc Copyright © 2007 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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