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  • Open Access

    ARTICLE

    Object-Oriented Modeling of Solid Material in Nonlinear Applications

    Hamid Sharifi1 and Augustin Gakwaya1

    CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 77-96, 2006, DOI:10.3970/cmc.2006.003.077

    Abstract In this paper, an object-oriented modeling of solid material constitutive behavior using the UML notation is presented. Material properties are first classified into large and small deformation kinematical models. In the small deformation package, we keep classes such as Elastic, ElastoPlastic, ViscoElastic and ViscoPlastic. In the large deformation package, we store classes such as ElastoPlastic, HyperElastic, HyperPlastic, HyperViscoElastic, HyperViscoPlastic and so on. The hierarchical structure, the association relationships as well as key attributes and methods of these classes are presented. We used a C++ implementation of the above model for developing HyperElastic, HyperElastoPlastic and Contact More >

  • Open Access

    ARTICLE

    Analysis of Solids with Numerous Microcracks Using the Fast Multipole DBEM

    P. B. Wang1, Z. H. Yao1,2, T. Lei1

    CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 65-76, 2006, DOI:10.3970/cmc.2006.003.065

    Abstract The fast multipole method (FMM) is applied to the dual boundary element method (DBEM) for the analysis of finite solids with large numbers of microcracks. The application of FMM significantly enhances the run-time and memory storage efficiency. Combining multipole expansions with local expansions, computational complexity and memory requirement are both reduced to O(N), where N is the number of DOFs (degrees of freedom). This numerical scheme is used to compute the effective in-plane bulk modulus of 2D solids with thousands of randomly distributed microcracks. The results prove that the IDD method, the differential method, and the More >

  • Open Access

    ARTICLE

    An Optimization Analysis of UBM Thicknesses and Solder Geometry on A Wafer Level Chip Scale Package Using Robust Methods

    Heng-Cheng Lin1, Chieh Kung2, Rong-Sheng Chen1, Gin-Tiao Liang1

    CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 55-64, 2006, DOI:10.3970/cmc.2006.003.055

    Abstract Wafer level chip scale package (WLCSP) has been recognized providing clear advantages over traditional wire-bond package in relaxing the need of underfill while offering high density of I/O interconnects. Without the underfill, the solder joint reliability becomes more critical. Adding to the reliability concerns is the safety demand trend toward "green'' products on which unleaded material, e.g. lead-free solders, is required. The requirement of lead-free solders on the packages results in a higher reflow temperature profile in the package manufacturing process, in turn, complicating the reliability issue. This paper presents an optimization study, considering the… More >

  • Open Access

    ARTICLE

    A New Method of Controlling Shrinkage Cracking in Repaired Concrete Structures Using an Interface Layer of Carbon Fiber Reinforced Cement Mortar

    Shen Yubin1, Xie Huicai1,2, Den Wei1

    CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 49-54, 2006, DOI:10.3970/cmc.2006.003.049

    Abstract Bonding an overlay of new concrete onto the damaged concrete is a usual repair method. Because of the different shrinkage rate of the new and old concrete, restrained shrinkage cracks will appear in the new concrete. The cracks will reduce durability and strength of the repaired structure. A new repair method using an interface layer of carbon fiber reinforced cement mortar between new and old concrete was developed in this paper. The new method was found to be very effective in reducing shrinkage cracking of repaired beams and slabs. Comparing with normal repaired beams, the More >

  • Open Access

    ARTICLE

    Three-dimensional Ehrlich-Schwoebel Barriers of W

    Z. Xu1, L. G. Zhou1, Jian Wang1, Timothy S. Cale2, Hanchen Huang1,3

    CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 43-48, 2006, DOI:10.3970/cmc.2007.003.043

    Abstract Recent studies show that three-dimensional Ehrlich-Schwoebel (3D ES), or facet-facet, barriers of face-centered-cubic metals are substantially higher than other surface diffusion barriers. This paper presents the numerical results of 3D ES barriers for body-centered-cubic W, using classical molecular statics calculations and the nudged elastic band method. Results show that an adatom on W{110} has a diffusion barrier of 0.49 eV on the flat surface, 0.66 eV over a monolayer step, and 0.98 eV over a ridge to a neighboring {100} facet, which is one 3D ES barrier. More >

  • Open Access

    ARTICLE

    Lagrangian Equilibrium Equations in Cylindrical and Spherical Coordinates

    K.Y. Volokh 1

    CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 37-42, 2006, DOI:10.3970/cmc.2007.003.037

    Abstract Lagrangian or referential equilibrium equations for materials undergoing large deformations are of interest in the developing fields of mechanics of soft biomaterials and nanomechanics. The main feature of these equations is the necessity to deal with the First Piola-Kirchhoff, or nominal, stress tensor which is a two-point tensor referring simultaneously to the reference and current configurations. This two-point nature of the First Piola-Kirchhoff tensor is not always appreciated by the researchers and the total covariant derivative necessary for the formulation of the equilibrium equations in curvilinear coordinates is sometimes inaccurately confused with the regular covariant derivative. More >

  • Open Access

    ARTICLE

    Numerical Simulation of Elastic Behaviour and Failure Processes in Heterogeneous Material

    Lingfei Gao1, Xiaoping Zheng1,2, Zhenhan Yao1

    CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 25-36, 2006, DOI:10.3970/cmc.2007.003.025

    Abstract A general numerical approach is developed to model the elastic behaviours and failure processes of heterogeneous materials. The heterogeneous material body is assumed composed of a large number of convex polygon lattices with different phases. These phases are locally isotropic and elastic-brittle with the different lattices displaying variable material parameters and a Weibull-type statistical distribution. When the effective strain exceeds a local fracture criterion, the full lattice exhibits failure uniformly, and this is modelled by assuming a very small Young modulus value. An auto-select loading method is employed to model the failure process. The proposed More >

  • Open Access

    ARTICLE

    Numerical Modelling of Damage Response of Layered Composite Plates

    I. Smojver1, J. Sorić2

    CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 13-24, 2006, DOI:10.3970/cmc.2007.003.013

    Abstract The paper addresses the problem of impact on layered fibre composites. The behaviour of composite laminates under impact loading is dependent not only on the velocity but also on the mass and geometry of the impactor. Using micromechanical Mori-Tanaka approach, mechanical properties of the laminate have been calculated utilizing the material constants of the fibre and matrix. General purpose FEM software ABAQUS has been modified by means of user written subroutines for modelling of composite laminate and rigid impactor. The kinematics of the impact has been simulated using transient dynamic analysis. Employing user defined multi More >

  • Open Access

    ARTICLE

    The Boundary Contour Method for Magneto-Electro-Elastic Media with Linear Boundary Elements

    Aimin Jiang1,2, Haojiang Ding2

    CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 1-12, 2006, DOI:10.3970/cmc.2007.003.001

    Abstract This paper presents a development of the boundary contour method (BCM) for magneto-electro-elastic media. Firstly, the divergence-free of the integrand of the magneto- electro-elastic boundary element is proved. Secondly, the boundary contour method formulations are obtained by introducing linear shape functions and Green's functions (Computers & Structures, 82(2004):1599-1607) for magneto-electro-elastic media and using the rigid body motion solution to regularize the BCM and avoid computation of the corner tensor. The BCM is applied to the problem of magneto-electro-elastic media. Finally, numerical solutions for illustrative examples are compared with exact ones and those of the conventional boundary element More >

  • Open Access

    ABSTRACT

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