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Reliable Fracture Analysis of OF 2-D Crack Problems Using NI-MVCCI Technique

G.S. Palani1, Nagesh R. Iyer1, B. Dattaguru2

1 Structural Engineering Research Centre (SERC), CSIR Campus, Chennai, 600113, India.
2 Indian Institute of Science(IISc), Bangalore, 560 012, India

Structural Durability & Health Monitoring 2005, 1(2), 107-120. https://doi.org/10.3970/sdhm.2005.001.107

Abstract

A posteriori error estimation and adaptive refinement technique for 2-D/3-D crack problems is the state-of-the-art. In this paper a new a posteriori error estimator based on strain energy release rate (SERR) or stress intensity factor (SIF) at the crack tip region has been proposed and used along with the stress based error estimator for reliable fracture analysis of 2-D crack problems. The proposed a posteriori error estimator is called the K-S error estimator. Further, h-adaptive mesh refinement strategy which can be used with K-S error estimator has been proposed for fracture analysis of 2-D crack problems. The performance of the proposed a posteriori error estimator and the h-adaptive refinement strategy have been demonstrated by employing 4-noded, 8-noded and 9-noded plane stress finite elements. The proposed error estimator together with the h-adaptive refinement strategy will facilitate automation of fracture analysis process to provide reliable solutions.

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APA Style
Palani, G., Iyer, N.R., Dattaguru, B. (2005). Reliable fracture analysis of OF 2-D crack problems using NI-MVCCI technique. Structural Durability & Health Monitoring, 1(2), 107-120. https://doi.org/10.3970/sdhm.2005.001.107
Vancouver Style
Palani G, Iyer NR, Dattaguru B. Reliable fracture analysis of OF 2-D crack problems using NI-MVCCI technique. Structural Durability Health Monit . 2005;1(2):107-120 https://doi.org/10.3970/sdhm.2005.001.107
IEEE Style
G. Palani, N.R. Iyer, and B. Dattaguru "Reliable Fracture Analysis of OF 2-D Crack Problems Using NI-MVCCI Technique," Structural Durability Health Monit. , vol. 1, no. 2, pp. 107-120. 2005. https://doi.org/10.3970/sdhm.2005.001.107



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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