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The MLPG Method for Crack Analysis in Anisotropic Functionally Graded Materials

J. Sladek1, V. Sladek, Ch.Zhang2

1 Institute of Construction and Architecture, Slovak Academy of Sciences, 84503 Bratislava, Slovakia, email: sladek@savba.sk
2 Department of Civil Engineering, University of Siegen, D-57068 Siegen, Germany, email: c.zhang@uni-siegen.de

Structural Durability & Health Monitoring 2005, 1(2), 131-144. https://doi.org/10.3970/sdhm.2005.001.131

Abstract

A meshless method based on the local Petrov-Galerkin approach is proposed for crack analysis in two-dimensional (2-d), anisotropic and linear elastic solids with continuously varying material properties. Both quasi-static and transient elastodynamic problems are considered. For time-dependent problems, the Laplace-transform technique is utilized. A unit step function is used as the test function in the local weak-form. It is leading to local boundary integral equations (LBIEs) involving only a domain-integral in the case of transient dynamic problems. The analyzed domain is divided into small subdomains with a circular shape. The moving least-squares (MLS) method is adopted for approximating the physical quantities in the LBIEs. The accuracy of the present method for computing the mode-I stress intensity factors is discussed by comparison with available analytical or numerical solutions.

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APA Style
Sladek, J., Sladek, V., Ch.Zhang, (2005). The MLPG method for crack analysis in anisotropic functionally graded materials. Structural Durability & Health Monitoring, 1(2), 131-144. https://doi.org/10.3970/sdhm.2005.001.131
Vancouver Style
Sladek J, Sladek V, Ch.Zhang . The MLPG method for crack analysis in anisotropic functionally graded materials. Structural Durability Health Monit . 2005;1(2):131-144 https://doi.org/10.3970/sdhm.2005.001.131
IEEE Style
J. Sladek, V. Sladek, and Ch.Zhang "The MLPG Method for Crack Analysis in Anisotropic Functionally Graded Materials," Structural Durability Health Monit. , vol. 1, no. 2, pp. 131-144. 2005. https://doi.org/10.3970/sdhm.2005.001.131



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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