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An Investigation into Active Strain Transfer Analysis in a Piezoceramic Sensor System for Structural Health Monitoring Using the Dual Boundary Element Method

S.P.L. Leme1, M.H. Aliabadi2, L.M. Bezerra1, P.W. Partridge1

1 Departamento de Engenharia Civil e Ambiental, Universidade de Brasília – UnB
2 Aeronautics Department, Imperial College, University of London UK

Structural Durability & Health Monitoring 2007, 3(3), 121-132. https://doi.org/10.3970/sdhm.2007.003.121

Abstract

The coupled electromechanical behaviour of a thin piezoceramic sensor bonded to a stiffened panel subjected to membrane mechanical loadings is examined. The sensor is characterised by an electrostatic line model bonded to a damaged panel modelled by the dual boundary element method. Numerical results obtained demonstrate that the proposed method is capable of modelling changes in the signal output due to presence of cracks. Also presented is a numerical model for detecting fatigue crack growth in a stiffened panel using piezoceramic sensors.

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APA Style
Leme, S., Aliabadi, M., Bezerra, L., Partridge, P. (2007). An investigation into active strain transfer analysis in a piezoceramic sensor system for structural health monitoring using the dual boundary element method. Structural Durability & Health Monitoring, 3(3), 121-132. https://doi.org/10.3970/sdhm.2007.003.121
Vancouver Style
Leme S, Aliabadi M, Bezerra L, Partridge P. An investigation into active strain transfer analysis in a piezoceramic sensor system for structural health monitoring using the dual boundary element method. Structural Durability Health Monit . 2007;3(3):121-132 https://doi.org/10.3970/sdhm.2007.003.121
IEEE Style
S. Leme, M. Aliabadi, L. Bezerra, and P. Partridge "An Investigation into Active Strain Transfer Analysis in a Piezoceramic Sensor System for Structural Health Monitoring Using the Dual Boundary Element Method," Structural Durability Health Monit. , vol. 3, no. 3, pp. 121-132. 2007. https://doi.org/10.3970/sdhm.2007.003.121



cc Copyright © 2007 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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