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Hierarchal Decomposition for the Structure-Fluid-Electrostatic Interaction in a Microelectromechanical System

Daisuke Ishihara1,2, Tomoyoshi Horie1, Tomoya Niho1, Akiyoshi Baba3

Department of Mechanical Systems Engineering, Kyushu Institute of Technology, 680-4 Kawazu,Iizuka, Fukuoka 820-8502, Japan
Correspondence author. E-mail: ishihara@mse.kyutech.ac.jp
Center for Microelectronic System (CMS), Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan

Computer Modeling in Engineering & Sciences 2015, 108(6), 429-452. https://doi.org/10.3970/cmes.2015.108.429

Abstract

In this study, a hierarchal decomposition is proposed to solve the structure- fluid-electrostatic interaction in a microelectromechanical system (MEMS). In the proposed decomposition, the structure-fluid-electrostatic interaction is partitioned into the structure-fluid interaction and the electrostatic field using the iteratively staggered method, and the structure-fluid interaction is split into the structurefluid velocity field and the fluid pressure field using the projection method. The proposed decomposition is applied to a micro cantilever beam actuated by the electrostatic force in air. It follows from the comparisons among the numerical and experimental results that the proposed method can predict the MEMS vibration characteristics accurately.

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APA Style
Ishihara, D., Horie, T., Niho, T., Baba, A. (2015). Hierarchal decomposition for the structure-fluid-electrostatic interaction in a microelectromechanical system. Computer Modeling in Engineering & Sciences, 108(6), 429-452. https://doi.org/10.3970/cmes.2015.108.429
Vancouver Style
Ishihara D, Horie T, Niho T, Baba A. Hierarchal decomposition for the structure-fluid-electrostatic interaction in a microelectromechanical system. Comput Model Eng Sci. 2015;108(6):429-452 https://doi.org/10.3970/cmes.2015.108.429
IEEE Style
D. Ishihara, T. Horie, T. Niho, and A. Baba, “Hierarchal Decomposition for the Structure-Fluid-Electrostatic Interaction in a Microelectromechanical System,” Comput. Model. Eng. Sci., vol. 108, no. 6, pp. 429-452, 2015. https://doi.org/10.3970/cmes.2015.108.429



cc Copyright © 2015 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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