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Computational Modeling of Intergranular Crack Propagation in an Intermetallic Compound Layer

Tong An1,2,*, Rui Zhou1,2, Fei Qin1,2,*, Pei Chen1,2, Yanwei Dai1,2, Yanpeng Gong1,2

1 Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
2 Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing, 100124, China

* Corresponding Authors: Tong An. Email: ; Fei Qin. Email:

(This article belongs to this Special Issue: Mechanical Reliability of Advanced Materials and Structures for Harsh Applications)

Computer Modeling in Engineering & Sciences 2023, 135(2), 1481-1502. https://doi.org/10.32604/cmes.2023.022475

Abstract

A micromechanical model is presented to study the initiation and propagation of microcracks of intermetallic compounds (IMCs) in solder joints. The effects of the grain aggregate morphology, the grain boundary defects and the sensitivity of the various cohesive zone parameters in predicting the overall mechanical response are investigated. The overall strength is predominantly determined by the weak grain interfaces; both the grain aggregate morphology and the weak grain interfaces control the crack configuration; the different normal and tangential strengths of grain interfaces result in different intergranular cracking behaviors and play a critical role in determining the macroscopic mechanical response of the system.

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Cite This Article

An, T., Zhou, R., Qin, F., Chen, P., Dai, Y. et al. (2023). Computational Modeling of Intergranular Crack Propagation in an Intermetallic Compound Layer. CMES-Computer Modeling in Engineering & Sciences, 135(2), 1481–1502.



This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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