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MPI/OpenMP-Based Parallel Solver for Imprint Forming Simulation

Yang Li1, Jiangping Xu1,*, Yun Liu1, Wen Zhong2,*, Fei Wang3

1 School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212016, China
2 School of Mechanical Engineering, Wuhan Polytechnic University, Wuhan, 430023, China
3 Shenyang Mint Company Limited, Shenyang, 110092, China

* Corresponding Authors: Jiangping Xu. Email: email; Wen Zhong. Email: email

TSP_CMES_46467.pdf

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