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Finite Element Modeling of Thermo-Viscoelastoplastic Behavior of Dievar Alloy under Hot Rotary Swaging
1 Department of Manufacturing Technology, Faculty of Mechanical Engineering, Brno University of Technology, Brno, 61600, Czech Republic
2 Department of Metallurgical Technologies, Faculty of Materials Science and Technology, VŠB Technical University of Ostrava, Ostrava, 70800, Czech Republic
* Corresponding Author: Josef Izák. Email:
Computer Modeling in Engineering & Sciences 2025, 142(3), 3115-3133. https://doi.org/10.32604/cmes.2025.059234
Received 01 October 2024; Accepted 14 January 2025; Issue published 03 March 2025
Abstract
The paper deals with the FEM (Finite Element Method) simulation of rotary swaging of Dievar alloy produced by additive manufacturing technology Selective Laser Melting and conventional process. Swaging was performed at a temperature of 900°C. True flow stress-strain curves were determined for 600°C–900°C and used to construct a Hensel-Spittel model for FEM simulation. The process parameters, i.e., stress, temperature, imposed strain, and force, were investigation during the rotary swaging process. Firstly, the stresses induced during rotary swaging and the resistance of the material to deformation were investigated. The amount and distribution of imposed strain in the cross-section can serve as a valuable indicator of the reduction in porosity and the texture evolution of the material. The simulation revealed the force required to swag the Dievar alloy. It also showed the evolution of temperature, which is important for phase transformation during solidification. Furthermore, microstructure evolution was observed before and then after rotary swaging. Dievar alloy is a critical material in the manufacture of dies for high-pressure die casting, forging tools, and other equipment subjected to high temperatures and mechanical loads. Understanding its viscoelastoplastic behavior under rotary swaging conditions is essential to optimize its performance in these demanding industrial applications.Keywords
Cite This Article
Copyright © 2025 The Author(s). Published by Tech Science Press.This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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