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Transient Coupled Thermoelastic Contact Problems Incorporating Thermal Resistance: a BEM Approach

L.K. Keppas1, G.I. Giannopoulos1, N.K. Anifantis1

Machine Design Laboratory, Mechanical and Aeronautics Engineering Department, University of Patras, Rion 26500, Greece.

Computer Modeling in Engineering & Sciences 2008, 25(3), 181-196.


In the present paper a boundary element procedure is formulated to treat two-dimensional time dependent thermo-elastic contact problems incorporating thermal resistance along the contacting surfaces. The existence of pressure-dependent thermal contact leads to coupling of temperature and stress fields. Therefore, the inherent non-linearity of the problem demands simultaneous treating of both thermal and mechanical boundary integral equations while iterative procedures are introduced to ensure equilibrium of mechanical and thermal contact conditions at each step of the process. The transient behavior of interfacial cracks in bimaterial solids when undergo thermal shock in the presence of partial crack closure and thermal contact resistance may be an interesting aspect of engineering design. For this purpose the methodology is applied on a thermal barrier coating system (TBC). Near crack tip singularities of temperature and displacement fields are modeled through appropriate quarter-point singular elements. Fracture parameters are evaluated from nodal tractions of singular elements utilizing proper formulas. Numerical results are compared with available solutions from the literature, where possible. Good agreement between them can be found.


Cite This Article

Keppas, L., Giannopoulos, G., Anifantis, N. (2008). Transient Coupled Thermoelastic Contact Problems Incorporating Thermal Resistance: a BEM Approach. CMES-Computer Modeling in Engineering & Sciences, 25(3), 181–196.

cc This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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