Open Access

ARTICLE

Fast analysis system for embossing process simulation of commemorative coin--CoinForm

J. P. Xu¹, Y. Q. Liu^1,2, S. Q. Li³, S. C. Wu⁴

1 State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, PR China
2 Corresponding author at: State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology, 1037 Luoyu Road, Wuhan Hubei 430074, PR China. Tel.: +86 27 87558193; fax: +86 27 87554405; Email: fastamp@vip.sina.com (Liu Yuqi)
3 Shenyang Mint, Shenyang, 110042, PR China
4 School of Materials Science and Engineering, Hefei University of Technology, Hefei, 230009, PR China

Computer Modeling in Engineering & Sciences 2008, 38(3), 201-216. https://doi.org/10.3970/cmes.2008.038.201

Abstract

For the first time, a special-purpose finite element simulation system CoinForm is developed to analyze the embossing process of commemorative coin, in which one-point reduced integration approach is used in solid element finite element dynamic explicit program. Viscous damping hourglass control algorithm can effectively suppress the spurious modes activated by reduced integration and the computational effort is saved about 93% compared with other method that evaluate anti-hourglass force using stabilization matrix. The embossing process of commemorative coin is then simulated and compared with results from the DEFORM 3D software, which verify the excellent performance of present CoinForm system. According to the flow law of materials from simulation results, this system is found to better improve the geometry of piece for the high quality printed pattern. More importantly, the criterion for positioning the zone of band is obtained in terms of simulation results, which can significantly avoid the defect of light band by optimizing the shape of piece.

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Keywords

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