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Bond Graph Modelling and Simulation of Static Recrystallization Kinetics in Multipass Hot Steel Rolling

S.K. Pal1, D.A. Linkens2

Dept. of Mechanical Engineering, Indian Institute of Technology Kharagpur, 721 302, West Bengal, India
Dept. of Automatic Control and Systems Engineering, The University of Sheffield, Mappin Street, Sheffield, S1 3JD, United Kingdom

Computers, Materials & Continua 2005, 2(2), 113-118. https://doi.org/10.3970/cmc.2005.002.113

Abstract

In hot rolling, the final thickness of the strip is achieved through plastic deformation of the original stock by a series of counter-rotating rollers. In this work, static recrystallization kinetics in between two stages of steel rolling has been modelled, and simulation studies have also been performed to find out the effect of entry temperature on the recrystallization kinetics. A viable bond graph model has been developed to study the kinetics of the process. Low-carbon steel has been considered for this purpose.

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APA Style
Pal, S., Linkens, D. (2005). Bond graph modelling and simulation of static recrystallization kinetics in multipass hot steel rolling. Computers, Materials & Continua, 2(2), 113-118. https://doi.org/10.3970/cmc.2005.002.113
Vancouver Style
Pal S, Linkens D. Bond graph modelling and simulation of static recrystallization kinetics in multipass hot steel rolling. Comput Mater Contin. 2005;2(2):113-118 https://doi.org/10.3970/cmc.2005.002.113
IEEE Style
S. Pal and D. Linkens, "Bond Graph Modelling and Simulation of Static Recrystallization Kinetics in Multipass Hot Steel Rolling," Comput. Mater. Contin., vol. 2, no. 2, pp. 113-118. 2005. https://doi.org/10.3970/cmc.2005.002.113



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