Open Access
ARTICLE
Tuan Nguyen Kim1,*, Duy Ho Ngoc2, Nikolay A. Moldovyan3
1 School of Computer Science, Duy Tan University, Danang, Vietnam
2 Department of Information Technology, Hanoi, Vietnam
3 ITMO University, St. Petersburg, Russia
* Corresponding Author: Tuan Nguyen Kim. Email:
Computers, Materials & Continua 2023, 74(1), 1475-1491. https://doi.org/10.32604/cmc.2023.029253
Received 28 February 2022; Accepted 06 April 2022; Issue published 22 September 2022
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