Open Access iconOpen Access

ARTICLE

crossmark

MD Simulation of Diffusion Behaviors in Collision Welding Processes of Al-Cu, Al-Al, Cu-Cu

Dingyi Jin1, Guo Wei2,*

1 School of Intelligent Manufacturing, Hunan First Normal University, Changsha, 410082, China
2 School of Physics and Technology, Center for Ion Beam Application, Hubei Nuclear Solid Physics Key Laboratory, Wuhan University, Wuhan, 430072, China

* Corresponding Author: Guo Wei. Email: email

Computers, Materials & Continua 2024, 79(3), 3455-3468. https://doi.org/10.32604/cmc.2024.048644

Abstract

To investigate the effects of material combinations and velocity conditions on atomic diffusion behavior near collision interfaces, this study simulates the atomic diffusion behavior near collision interfaces in Cu-Al, Al-Al and Cu-Cu combinations fabricated through collision welding using molecular dynamic (MD) simulation. The atomic diffusion behaviors are compared between similar metal combinations (Al-Al, Cu-Cu) and dissimilar metal combinations (Al-Cu). By combining the simulation results and classical diffusion theory, the diffusion coefficients for similar and dissimilar metal material combinations under different velocity conditions are obtained. The effects of material combinations and collision velocity on diffusion behaviors are also discussed. The diffusion behaviors of dissimilar material combinations strongly depend on the transverse velocity, whereas those of the similar material combinations are more dependent on the longitudinal velocity. These findings can provide guidance for optimizing welding parameters.

Keywords


Cite This Article

APA Style
Jin, D., Wei, G. (2024). MD simulation of diffusion behaviors in collision welding processes of al-cu, al-al, cu-cu. Computers, Materials & Continua, 79(3), 3455-3468. https://doi.org/10.32604/cmc.2024.048644
Vancouver Style
Jin D, Wei G. MD simulation of diffusion behaviors in collision welding processes of al-cu, al-al, cu-cu. Comput Mater Contin. 2024;79(3):3455-3468 https://doi.org/10.32604/cmc.2024.048644
IEEE Style
D. Jin and G. Wei, "MD Simulation of Diffusion Behaviors in Collision Welding Processes of Al-Cu, Al-Al, Cu-Cu," Comput. Mater. Contin., vol. 79, no. 3, pp. 3455-3468. 2024. https://doi.org/10.32604/cmc.2024.048644



cc This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
  • 420

    View

  • 130

    Download

  • 0

    Like

Share Link