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Atomistic Simulation Study on Spall Failure and Damage Evolution in Single-Crystalline Ta at Elevated Temperatures

Yuntian Wang1,2, Taohua Liang1,2, Yuan Zhou1,2, Weimei Shi1,2, Lijuan Huang1,2, Yuzhu Guo3,*

1 Sichuan Provincial Engineering Research Center of Thermoelectric Materials and Devices, Chengdu, 610041, China
2 Postdoctor Innovation and Practice Base, Chengdu Polytechnic, Chengdu, 610041, China
3 School of Civil Engineering, Changsha University of Science and Technology, Changsha, 410114, China

* Corresponding Author: Yuzhu Guo. Email: email

Computers, Materials & Continua 2026, 86(2), 1-26. https://doi.org/10.32604/cmc.2025.071624

Abstract

This investigation utilizes non-equilibrium molecular dynamics (NEMD) simulations to explore shock-induced spallation in single-crystal tantalum across shock velocities of 0.75–4 km/s and initial temperatures from 300 to 2000 K. Two spallation modes emerge: classical spallation for shock velocity below 1.5 km/s, with solid-state reversible Body-Centered Cubic (BCC) to Face-Centered Cubic (FCC) or Hexagonal Close-Packed (HCP) phase transformations and discrete void nucleation-coalescence; micro-spallation for shock velocity above 3.0 km/s, featuring complete shock-induced melting and fragmentation, with a transitional regime (2.0–2.5 km/s) of partial melting. Spall strength decreases monotonically with temperature due to thermal softening. Elevated temperatures delay void nucleation but increase density, expanding spall regions and enhancing structural disorder with reduced BCC recovery. For micro-spallation, melting exacerbates damage, causing smaller voids and intensified atomic ejection, which increases with temperature. Free surface velocity profiles indicate damage: in classical spallation, first drop marks nucleation, and pullback signals spall layers. In micro-spallation, the first drop is irrelevant, but remains valid. Temperature delays pullback signals and weakens Hugoniot Elastic Limit. This study clarifies temperature-shock coupling in Ta spallation, aiding failure prediction in high-temperature shock environments.

Keywords

Single-crystal tantalum; temperature effect; shock-induced spallation; damage evolution

Cite This Article

APA Style
Wang, Y., Liang, T., Zhou, Y., Shi, W., Huang, L. et al. (2026). Atomistic Simulation Study on Spall Failure and Damage Evolution in Single-Crystalline Ta at Elevated Temperatures. Computers, Materials & Continua, 86(2), 1–26. https://doi.org/10.32604/cmc.2025.071624
Vancouver Style
Wang Y, Liang T, Zhou Y, Shi W, Huang L, Guo Y. Atomistic Simulation Study on Spall Failure and Damage Evolution in Single-Crystalline Ta at Elevated Temperatures. Comput Mater Contin. 2026;86(2):1–26. https://doi.org/10.32604/cmc.2025.071624
IEEE Style
Y. Wang, T. Liang, Y. Zhou, W. Shi, L. Huang, and Y. Guo, “Atomistic Simulation Study on Spall Failure and Damage Evolution in Single-Crystalline Ta at Elevated Temperatures,” Comput. Mater. Contin., vol. 86, no. 2, pp. 1–26, 2026. https://doi.org/10.32604/cmc.2025.071624



cc Copyright © 2026 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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