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IConFuzz: Constraint-Aware Argument Mutation for Effective Smart Contract Fuzzing

Hojin Choi, Jaeseung Choi*

Department of Computer Science and Engineering, Sogang University, Seoul, Republic of Korea

* Corresponding Author: Jaeseung Choi. Email: email

(This article belongs to the Special Issue: Advanced Security and Privacy in Blockchain Systems)

Computers, Materials & Continua 2026, 88(3), 89 https://doi.org/10.32604/cmc.2026.082577

Abstract

Recently, extensive research has focused on addressing the unique challenges of smart contract fuzzing. Nevertheless, existing fuzzers still struggle to generate adequate function call arguments that can explore the deep smart contract states. In this paper, we introduce novel classes of argument constraints that capture the inter-argument relationships required to exercise meaningful contract logic. We propose a static analysis algorithm to extract these constraints from Solidity source code. In addition, we design a constraint-aware argument mutation strategy that leverages the identified constraints to guide test case generation for smart contract fuzzing. We implement our approach in a fuzzer named IConFuzz. Our evaluation on realistic benchmarks with integer overflow, suicidal contract, and ether leakage vulnerabilities demonstrates that IConFuzz outperforms state-of-the-art testing tools in both the number of bugs discovered and the speed of bug detection.

Keywords

Software testing; static analysis; fuzzing; smart contract security

Cite This Article

APA Style
Choi, H., Choi, J. (2026). IConFuzz: Constraint-Aware Argument Mutation for Effective Smart Contract Fuzzing. Computers, Materials & Continua, 88(3), 89. https://doi.org/10.32604/cmc.2026.082577
Vancouver Style
Choi H, Choi J. IConFuzz: Constraint-Aware Argument Mutation for Effective Smart Contract Fuzzing. Comput Mater Contin. 2026;88(3):89. https://doi.org/10.32604/cmc.2026.082577
IEEE Style
H. Choi and J. Choi, “IConFuzz: Constraint-Aware Argument Mutation for Effective Smart Contract Fuzzing,” Comput. Mater. Contin., vol. 88, no. 3, pp. 89, 2026. https://doi.org/10.32604/cmc.2026.082577



cc Copyright © 2026 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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