Open Access
ARTICLE
A Novel Meshfree Analysis of Transient Heat Conduction Problems Using RRKPM
1 College of Intelligent Engineering, Shandong Management University, Jinan, 250357, China
2 School of Mechanical and Automotive Engineering, Qilu University of Technology (Shandong Academy of Sciences), Jinan, 250353, China
3 Shandong Institute of Mechanical Design and Research, Jinan, 250353, China
* Corresponding Author: Gaofeng Wei. Email:
(This article belongs to this Special Issue: Numerical Methods in Engineering Analysis, Data Analysis and Artificial Intelligence)
Computer Modeling in Engineering & Sciences 2022, 131(3), 1793-1814. https://doi.org/10.32604/cmes.2022.019687
Received 08 October 2021; Accepted 18 November 2021; Issue published 19 April 2022