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Precursor Film Length Ahead Droplet Traveling on Solid Substrate

I. Ueno1, T. Konisho2, T. Kawase3, T. Watanabe4

Tokyo University of Science, Noda, Chiba, Japan
Graduate School, Tokyo University of Science, Noda, Chiba, Japan
Undergraduate, Tokyo University of Science, Noda, Chiba, Japan (present: Denso Corp., Aichi, Japan)
Graduate School, Tokyo University of Science, Noda, Chiba, Japan (present: JTEKT Corp., Aichi, Japan)

Fluid Dynamics & Materials Processing 2008, 4(1), 21-26. https://doi.org/10.3970/fdmp.2008.004.021

Abstract

The present authors carried out an experimental study with a special interest upon the dynamics of the fluid in the vicinity of the boundary line of three phases; solid-liquid-gas interface, which is so-called `contact line.' The moving droplet on the solid substrate is accompanied with the movement of the boundary line of three phases; solid-liquid-gas interface, which is so-called macroscopic 'contact line.' Existing studies have indicated there is a thin liquid film known as 'precursor film' ahead the contact line of the droplet. In the present study the precursor film was detected by applying conventional ellipsometer, and its existing length was evaluated as a function of a dimensionless Capillary number. The present authors also indicate the effect of tiny particle sitting on the solid surface upon the traveling droplet and precursor film dynamics.

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APA Style
Ueno, I., Konisho, T., Kawase, T., Watanabe, T. (2008). Precursor film length ahead droplet traveling on solid substrate. Fluid Dynamics & Materials Processing, 4(1), 21-26. https://doi.org/10.3970/fdmp.2008.004.021
Vancouver Style
Ueno I, Konisho T, Kawase T, Watanabe T. Precursor film length ahead droplet traveling on solid substrate. Fluid Dyn Mater Proc. 2008;4(1):21-26 https://doi.org/10.3970/fdmp.2008.004.021
IEEE Style
I. Ueno, T. Konisho, T. Kawase, and T. Watanabe, “Precursor Film Length Ahead Droplet Traveling on Solid Substrate,” Fluid Dyn. Mater. Proc., vol. 4, no. 1, pp. 21-26, 2008. https://doi.org/10.3970/fdmp.2008.004.021



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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