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STUDY OF SUBSTRATE CONDUCTANCE EFFECT ON THE COOLING OF ELECTRONIC COMPONENTS

Shankar Durgam

College of Engineering Pune, Maharashtra, 445001, India
* Corresponding author. Email: sodiitm@gmail.com

Frontiers in Heat and Mass Transfer 2022, 18, 1-10. https://doi.org/10.5098/hmt.18.49

Abstract

This article explores experimentally and numerically the effect of conductance on cooling of electronic chips by forced air flow in a vertical channel for thermal control. Experiments are conducted using substrates of FR4, bakelite, copper clad board (single layer) equipped with aluminum heat sources at uniform heat fluxes of 1000, 2000, and 3000 W/m2 at 500 ≤ Re ≤ 1500. Computer simulations are performed to validate experimental results using a finite element method based COMSOL Multiphysics 4.3b software and the results are in agreements of below 10%. The temperatures obtained showed high thermal conductance copper clad boards (CCBs) are very low compared to FR4 and bakelite substrates. Results showed that FR4 and bakelite are unsuitable for airflow velocity of 0.6 m/s and heat flux of 3000 W/m2 . However, the temperature variation between single and multilayer CCB is 3 to 4 ◦C. The temperature reduction using CCB is 10 ◦C compared to FR4 and bakelite.

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Cite This Article

Durgam, S. (2022). STUDY OF SUBSTRATE CONDUCTANCE EFFECT ON THE COOLING OF ELECTRONIC COMPONENTS. Frontiers in Heat and Mass Transfer, 18(1), 1–10.



cc This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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