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A Novel Approach for Improving the PQ in SPIM

P. Jenitha Deepa*, H. Habeebullah Sait

Department of Electrical and Electronics Engineering, University College of Engineering, Anna University (BIT CAMPUS), Trichy, 620 024, India

* Corresponding Author: P. Jenitha Deepa. Email: email

Intelligent Automation & Soft Computing 2023, 35(3), 2703-2715. https://doi.org/10.32604/iasc.2023.030496

Abstract

Single Phase Induction Motor (SPIM) is widely used in industries at starting stage to provide high starting torque. The objective of the work is to develop a drive for Single Phase Induction Motor that does not use a start or run capacitor. In this work, the researchers present the details about Maximum Power Point Tracking using series-compensated Buck Boost Converter, resonant Direct Current (DC) to Alternate Current (AC) inverter and matrix converter-based drive. The proposed method provides a variable starting torque feature that can be adjusted depending upon machine load to ensure Power Quality (PQ). The system uses Series Compensated Buck Boost Converter (SCBBC) to derive the power from solar source and a Partial Resonant Inverter (PRI) between the Matrix Converter (MC) and DC link battery to reduce the switching loss. The application of Space Vector Pulse Width Modulation (SVPWM) ensures the improvement of power quality at driving terminals of SPIM. The proposed system has been mathematically modelled and simulated in MATLAB SIMULINK environment and was validated using standardized experimental verification.

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Cite This Article

APA Style
Deepa, P.J., Sait, H.H. (2023). A novel approach for improving the PQ in SPIM. Intelligent Automation & Soft Computing, 35(3), 2703-2715. https://doi.org/10.32604/iasc.2023.030496
Vancouver Style
Deepa PJ, Sait HH. A novel approach for improving the PQ in SPIM. Intell Automat Soft Comput . 2023;35(3):2703-2715 https://doi.org/10.32604/iasc.2023.030496
IEEE Style
P.J. Deepa and H.H. Sait, “A Novel Approach for Improving the PQ in SPIM,” Intell. Automat. Soft Comput. , vol. 35, no. 3, pp. 2703-2715, 2023. https://doi.org/10.32604/iasc.2023.030496



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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