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Peeling by Pulling: Characterizing the Mechanical Behavior of Nanoscale Thin Films
Zhaohe Dai1,*
1 Department of Mechanics and Engineering Science, College of Engineering, Peking University, Beijing, 100871, China
* Corresponding Author: Zhaohe Dai. Email:
The International Conference on Computational & Experimental Engineering and Sciences 2023, 26(2), 1-1. https://doi.org/10.32604/icces.2023.09223
Abstract
The flexible and clinging nature of ultra-thin films require the understanding of their elastic and adhesive
properties in a wide range of circumstances from fabrications to applications. Simultaneously measuring
both properties, however, is extremely difficult as the film thickness diminishes to nanoscales. In this talk, I
will show our recent work that addresses such difficulties through peeling by vertically pulling thin films off
from the substrates (we thus refer to it as “pull-to-peel”). Particularly, we perform in-situ pull-to-peel of
graphene and MoS2 films in a scanning electron microscope and achieve simultaneous determination of
their Young’s moduli and adhesions to gold substrates. This is in striking contrast to other conceptually
similar tests available in the literature, including indentation tests (only measuring elasticity) and
spontaneous blisters (only measuring adhesion). Furthermore, we show a weakly nonlinear Hooke’s
relation for the pull-to-peel response of two-dimensional materials, which may be harnessed for the design
of nanoscale force sensors or exploited in other thin-film systems.
Keywords
Cite This Article
APA Style
Dai, Z. (2023). Peeling by pulling: characterizing the mechanical behavior of nanoscale thin films. The International Conference on Computational & Experimental Engineering and Sciences, 26(2), 1-1. https://doi.org/10.32604/icces.2023.09223
Vancouver Style
Dai Z. Peeling by pulling: characterizing the mechanical behavior of nanoscale thin films. Int Conf Comput Exp Eng Sciences . 2023;26(2):1-1 https://doi.org/10.32604/icces.2023.09223
IEEE Style
Z. Dai, "Peeling by Pulling: Characterizing the Mechanical Behavior of Nanoscale Thin Films," Int. Conf. Comput. Exp. Eng. Sciences , vol. 26, no. 2, pp. 1-1. 2023. https://doi.org/10.32604/icces.2023.09223