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Novel Approaches of Using of Spirulina Platensis in Natural Rubber Based Composites

Ewa Głowińska*, Janusz Datta, Paulina Parcheta and Natalia Kaźmierczak

Department of Polymers Technology, Gdańsk University of Technology, Narutowicza Street 11/12, 80-233 Gdańsk, Poland

*Corresponding author: email

Journal of Renewable Materials 2018, 6(7), 680-687. https://doi.org/10.32604/JRM.2018.00003

Abstract

The aim of this work was to investigate the influence of Spirulina (Spirulina platensis) as a natural filler on the curing characterization, morphology and mechanical, thermomechanical and thermal properties of natural rubber (NR) based composites. Spirulina was introduced into NR mixture in amount of 0 phr, 10 phr and 30 phr. The vulcanization process was carried out at the determined process condition by using hydraulic press at optimum vulcanization time (t90). It was noticed that Spirulina affected on the reduction of t90, and scorch time (t2) of the NR mixtures. Obtained vulcanizates were subjected to the number of tests e.g. scanning electron microscopy analysis, mechanical dynamical analysis, tensile test, hardness, and thermogravimetry. Generally, it was found that Spirulina added in amount of 10 phr NR positively influenced on tensile strength (TSb), storage modulus and hardness of obtained composites.

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APA Style
Głowińska*, E., Datta, J., Kaźmierczak, P.P.A.N. (2018). Novel approaches of using of spirulina platensis in natural rubber based composites. Journal of Renewable Materials, 6(7), 680-687. https://doi.org/10.32604/JRM.2018.00003
Vancouver Style
Głowińska* E, Datta J, Kaźmierczak PPAN. Novel approaches of using of spirulina platensis in natural rubber based composites. J Renew Mater. 2018;6(7):680-687 https://doi.org/10.32604/JRM.2018.00003
IEEE Style
E. Głowińska*, J. Datta, and P.P.A.N. Kaźmierczak, “Novel Approaches of Using of Spirulina Platensis in Natural Rubber Based Composites,” J. Renew. Mater., vol. 6, no. 7, pp. 680-687, 2018. https://doi.org/10.32604/JRM.2018.00003

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cc Copyright © 2018 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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