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Germination of grasses and shrubs under various water stress and temperature conditions

Bonvissuto GL1, CA Busso2

INTA E.E.A. Bariloche, C.C. 277, 8400 - San Carlos de Bariloche, Río Negro, Argentina.
Departamento de Agronomía y CERZOS (CONICET), Altos del Palihue, 8000 - Bahía Blanca, Buenos Aires, Argentina.
Address Correspondence to: Carlos A. Busso, Departamento de Agronomía-CERZOS (CONICET), Altos del Palihue, 8000 – Bahía Blanca, Buenos Aires, Argentina, e-mail: cebusso@criba.edu.ar.

Phyton-International Journal of Experimental Botany 2007, 76(all), 119-131. https://doi.org/10.32604/phyton.2007.76.119

Abstract

The effects of various temperature combinations and water potentials were determined on the germination of Atriplex lampa Gill. ex Moquin, Larrea divaricata Cav., Leymus erianthus (Phil.) Dubcovsky, Stipa neaei Nees ex Steudel and Poa ligularis Nees ap. Steudel under controlled conditions. The tested hypothesis was that seed germination increases with increasing temperatures and water potentials in A. lampa, L. divaricata, L. erianthus, S. neaei and P. ligularis, and that time to reach 50% of total germination is greater at lower than higher water potentials. PEG 2000 was used to impose water stress conditions. In general, obtained results conducted to accept the posted hyphotesis.

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APA Style
GL, B., Busso, C. (2007). Germination of grasses and shrubs under various water stress and temperature conditions. Phyton-International Journal of Experimental Botany, 76(all), 119-131. https://doi.org/10.32604/phyton.2007.76.119
Vancouver Style
GL B, Busso C. Germination of grasses and shrubs under various water stress and temperature conditions. Phyton-Int J Exp Bot. 2007;76(all):119-131 https://doi.org/10.32604/phyton.2007.76.119
IEEE Style
B. GL and C. Busso, “Germination of grasses and shrubs under various water stress and temperature conditions,” Phyton-Int. J. Exp. Bot., vol. 76, no. all, pp. 119-131, 2007. https://doi.org/10.32604/phyton.2007.76.119



cc Copyright © 2007 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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