Home / Advanced Search

  • Title/Keywords

  • Author/Affliations

  • Journal

  • Article Type

  • Start Year

  • End Year

Update SearchingClear
  • Articles
  • Online
Search Results (1)
  • Open Access


    First-principles Calculation of Interfacial Adhesion Strength and Electromigration for the Micro-bump Interconnect of 3D Chip Stacking Packaging

    W.H. Chen1, H.C. Cheng2,3, C.F. Yu1,3

    CMES-Computer Modeling in Engineering & Sciences, Vol.109-110, No.1, pp. 1-13, 2015, DOI:10.3970/cmes.2015.109.001

    Abstract This study aims at exploring the interfacial adhesion strength between solder bump and four typical under bump metallurgies (UBMs), i.e., Cu/Ni, Cu/TiW, Cu/Ni/Cr and /Cu/V/Cr, at atomistic scale. The average bond length and interfacial adhesion stress of the Sn-3.5Ag/Cu/Ni, Sn-3.5Ag/Cu/TiW, Sn-3.5Ag/Cu/Ni/Cr and Sn-3.5Ag/Cu/V/Cr micro-bump interconnects are calculated through the firstprinciples density functional theory (DFT) calculation to estimate the interfacial adhesion strength between the solder bump and UBMs. In addition, by investigating the electric field effect on the average bond length and adhesive stress, the combination of solder bump and UBM with better interfacial adhesion strength… More >

Displaying 1-10 on page 1 of 1. Per Page