Su-Tsai Lu1,2, Wen-Hwa Chen1
The International Conference on Computational & Experimental Engineering and Sciences, Vol.11, No.2, pp. 47-48, 2009, DOI:10.3970/icces.2009.011.047
Abstract For future growing applications in flexible display and wearable electronics, the need of three-dimensional stacking flexible interconnects increases rapidly. One of the core technologies is the development of ultra-thin chip-on-flex (UTCOF) interconnects owing to its high-density and flexibility as chips are thinned down and joined on a flexible substrate using anisotropic conductive adhesive (ACA) (Chen et al., 1999; Jokinen and Ristolainen, 2002; Lu et al., 2006; Lu and Chen, 2008). However, very little work has been devoted to the study of ACA material properties on the thermal-induced warpage for UTCOF interconnects and becomes the main… More >