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The Use of the Tangential Differential Operator in the Dual Boundary Element Equation

L. Palermo Jr.1, L.P.C.P.F. Almeida2, P.C. Gonçalves3

1 FEC/UNICAMP, Campinas, SP, Brazil–leandro@fec.unicamp.br
2 FEC/UNICAMP, Campinas, SP, Brazil
3 FEC/UNICAMP, Campinas, SP, Brazil

Structural Durability & Health Monitoring 2006, 2(2), 123-130. https://doi.org/10.3970/sdhm.2006.002.123

Abstract

The kernels of integrands are usually differentiated to obtain the general boundary integral equation (BIE) for stresses and its corresponding traction equation. An alternative BIE for stresses can be obtained when the tangential differential operator is introduced in problems using Kelvin type fundamental solutions. The order of the singularity is reduced with this strategy and the Cauchy principal value sense or the first order regularization can be used in the resultant BIE. The dual boundary element formulation with the BIE for tractions using the tangential differential operator is analyzed in the present study. Shape functions with same expressions for conformal or non-conformal interpolations are adopted and conformal interpolations were applied on the crack surface without losing the accuracy of the dual formulation. The results obtained are compared with solutions available from the literature to evaluate the formulation.

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APA Style
Jr., L.P., Almeida, L., Gonçalves, P. (2006). The use of the tangential differential operator in the dual boundary element equation. Structural Durability & Health Monitoring, 2(2), 123-130. https://doi.org/10.3970/sdhm.2006.002.123
Vancouver Style
Jr. LP, Almeida L, Gonçalves P. The use of the tangential differential operator in the dual boundary element equation. Structural Durability Health Monit . 2006;2(2):123-130 https://doi.org/10.3970/sdhm.2006.002.123
IEEE Style
L.P. Jr., L. Almeida, and P. Gonçalves, “The Use of the Tangential Differential Operator in the Dual Boundary Element Equation,” Structural Durability Health Monit. , vol. 2, no. 2, pp. 123-130, 2006. https://doi.org/10.3970/sdhm.2006.002.123



cc Copyright © 2006 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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