Open Access

ARTICLE

Mechanical Properties Measurement of Soft Materials by Three-Dimensional Digital Image Correlation Method

Wei-Chung Wang¹, Yu-An Chiang¹, Yi-Chieh Ho¹, Hung-Tsan Shen¹, Ting-Yu Chang¹, Ya-Hsin Chang¹, Chun-Sheng Tsao¹

1 Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, Republic of China

Structural Longevity 2012, 7(3), 151-160. https://doi.org/10.3970/sl.2012.007.151

Abstract

The rapid development of soft materials in recent years gives revolutionary impact on electronics and biomedical industries. To better control the quality and key technology, mechanical properties of soft materials employed in electronics and biomedical industries must be accurately determined By employing the non-destructive, non-contact and whole-field characteristics of the threedimensional (3D) digital image correlation (DIC) method, epoxy resin used in photoviscoelasticity, mechanical properties of optical films used in backlight modules and artificial meshes used in biomedical applications were investigated in this paper. It was found that satisfactory accuracy and measurement range can be obtained from the 3D-DIC method on the measurement of mechanical properties of soft materials.

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Keywords

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