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CORRECTION
Correction: Scheme Based on Multi-Level Patch Attention and Lesion Localization for Diabetic Retinopathy Grading
1 School of Computer and Communication Engineering, Changsha University of Science and Technology, Changsha, China
2 Hunan Province People’s Hospital (The First Affiliated Hospital of Hunan Normal University), Changsha, China
3 The First Affiliated Hospital of Guangxi Medical University, Nanning, China
4 International Graduate Institute of AI, National Yunlin University of Science and Technology, Yunlin, Taiwan
5 Department of Electrical and Computer Engineering, Lebanese American University, Bayrut, Lebanon
* Corresponding Author: Arun Kumar Sangaiah. Email:
(This article belongs to the Special Issue: Smart and Secure Solutions for Medical Industry)
Computer Modeling in Engineering & Sciences 2025, 144(2), 2683-2683. https://doi.org/10.32604/cmes.2025.069871
Issue published 31 August 2025
This article is a correction of:
Scheme Based on Multi-Level Patch Attention and Lesion Localization for Diabetic Retinopathy Grading
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This article has no abstract.In the article “Scheme Based on Multi-Level Patch Attention and Lesion Localization for Diabetic Retinopathy Grading” by Zhuoqun Xia, Hangyu Hu, Wenjing Li, Qisheng Jiang, Lan Pu, Yicong Shu, Arun Kumar Sangaiah (Computer Modeling in Engineering & Sciences, 2024, Vol. 140, No. 1, pp. 409–430. DOI: 10.32604/cmes.2024.030052, URL: https://www.techscience.com/CMES/v140n1/56173), there was an error regarding the affiliation for the author Arun Kumar Sangaiah. Instead of “International Graduate School of AI, National Yunlin University of Science and Technology, Yunlin, China”, the affiliation should be “International Graduate School of AI, National Yunlin University of Science and Technology, Yunlin, Taiwan”.
The authors apologize for any inconvenience caused and state that the scientific conclusions are unaffected. This correction was approved by the Editors-in-Chief and the Editorial Office of Computer Modeling in Engineering & Sciences. The corrected version of the article has been updated accordingly.
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Copyright © 2025 The Author(s). Published by Tech Science Press.This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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