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Finite Element Analysis of the Electromagnetics of Continuum

Shuaiqi Song, Lijie Grace Zhang, James D. Lee*

Department of Mechanical and Aerospace Engineering, The George Washington University, Washington, DC, USA

* Corresponding Author: James D. Lee. Email: email

Computer Modeling in Engineering & Sciences 2026, 147(3), 5 https://doi.org/10.32604/cmes.2026.080567

Abstract

The theory of thermomechanical-electromagnetic coupling was constructed. The finite element analysis of thermo-visco-elastic-plastic-electromagnetic continuum was formulated. Then the problem of wave propagation in this continuum was solved in two stages. In Stage I, a nearly static thermomechanical solution of a hollow cylinder, subject to twist and temperature gradient, was obtained. Then, in Stage II, the problem of wave propagation of scalar and vector potentials, due to deformation and temperature gradient, was solved. In the second approach, in Stage I, the static electric field and static magnetic field are obtained through static scalar and vector potentials, then in Stage II, the dynamic solutions of temperature, plastic strains, von Mises stress, and current were solved.

Keywords

Electromagnetics of continuum; finite element formulation; constitutive theory; thermo-visco-elastic-plastic-electromagnetic material; geometrically nonlinear; scalar and vector potentials

Cite This Article

APA Style
Song, S., Zhang, L.G., Lee, J.D. (2026). Finite Element Analysis of the Electromagnetics of Continuum. Computer Modeling in Engineering & Sciences, 147(3), 5. https://doi.org/10.32604/cmes.2026.080567
Vancouver Style
Song S, Zhang LG, Lee JD. Finite Element Analysis of the Electromagnetics of Continuum. Comput Model Eng Sci. 2026;147(3):5. https://doi.org/10.32604/cmes.2026.080567
IEEE Style
S. Song, L. G. Zhang, and J. D. Lee, “Finite Element Analysis of the Electromagnetics of Continuum,” Comput. Model. Eng. Sci., vol. 147, no. 3, pp. 5, 2026. https://doi.org/10.32604/cmes.2026.080567



cc Copyright © 2026 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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