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Theoretical Study on the Bilayer Buckling Technique for Thin Film Metrology

Fei Jia1, Xiu-Peng Zheng1,2, Yan-Ping Cao1,3, Xi-Qiao Feng1

AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
CNNC China Nuclear Power Engineering Co., Ltd. Beijing 100840, China
Corresponding author: Tel.: +86 10 62772520; e-mail: caoyanping@mail.tsinghua.edu.cn

Computers, Materials & Continua 2010, 18(2), 105-120. https://doi.org/10.3970/cmc.2010.018.105

Abstract

Recently, a novel technique based on the wrinkling of a bilayer composite film resting on a compliant substrate was proposed to measure the elastic moduli of thin films. In this paper, this technique is studied via theoretical analysis and finite element simulations. We find that under an applied compressive strain, the composite system may exhibit various buckling modes, depending upon the applied compressive strain, geometric and material parameters of the system. The physical mechanisms underlying the occurrence of the two most typical buckling modes are analyzed from the viewpoint of energy. When the intermediate layer is much thicker than the top layer, the condition under which the bilayer buckling will occur prior to other modes is given. The results reported here may facilitate the design of the bilayer buckling technique for the thin film metrology.

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APA Style
Jia, F., Zheng, X., Cao, Y., Feng, X. (2010). Theoretical study on the bilayer buckling technique for thin film metrology. Computers, Materials & Continua, 18(2), 105-120. https://doi.org/10.3970/cmc.2010.018.105
Vancouver Style
Jia F, Zheng X, Cao Y, Feng X. Theoretical study on the bilayer buckling technique for thin film metrology. Comput Mater Contin. 2010;18(2):105-120 https://doi.org/10.3970/cmc.2010.018.105
IEEE Style
F. Jia, X. Zheng, Y. Cao, and X. Feng, “Theoretical Study on the Bilayer Buckling Technique for Thin Film Metrology,” Comput. Mater. Contin., vol. 18, no. 2, pp. 105-120, 2010. https://doi.org/10.3970/cmc.2010.018.105



cc Copyright © 2010 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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