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ARTICLE
E. Laxmi Lydia1, T. M. Nithya2, K. Vijayalakshmi3, Jeya Prakash Kadambaajan4, Gyanendra Prasad Joshi5, Sung Won Kim6,*
1 Computer Science and Engineering, Vignan's Institute of Information Technology (Autonomous), Andhra Pradesh, 530049, India
2 Department of Computer Science and Engineering, K. Ramakrishnan College of Engineering, Tiruchirappalli, 621112, India
3 Department of Electronics & Communication Engineering, Saveetha School of Engineering, Saveetha Institute of Medical and Technical Sciences, Chennai, 600025, India
4 Department of Electronics & Communication Engineering, Kalasalingam Academy of Research and Education, Krishnankoil, 626128, India
5 Department of Computer Science and Engineering, Sejong University, Seoul, 05006, Korea
6 Department of Information and Communication Engineering, Yeungnam University, Gyeongsan-si, Gyeongbuk-do, 38541, Korea
* Corresponding Author: Sung Won Kim. Email:
Computers, Materials & Continua 2022, 73(1), 477-492. https://doi.org/10.32604/cmc.2022.025939
Received 09 December 2021; Accepted 13 January 2022; Issue published 18 May 2022
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